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Packathon 2022: students work on product residues

Publication date: April 1, 2022

On Tuesday 5 April, forty students will be boarding the bus to Heerenveen, where they will be participating in the Packathon 2022 at the National Test Centre for Circular Plastics (NTCP). This is the annual one-day design competition organised by the KIDV, which this time focuses on product residues. In other words: the last bits of mayonnaise, syrup, margarine or toothpaste in a squeeze bottle, tub or tube, packaging that ultimately all becomes waste.

Packathon 2022: students work on product residues

Can the students come up with an innovative solution to prevent this food wastage? At the same time, they will increase the chance of proper recycling of the packaging. The product residue often disrupts the sorting and recycling process. For example: a plastic bottle with product residue can be too heavy, so it is not sorted properly and does not end up in the right plastic fraction (for recycling). This then makes this packaging non-recyclable or limited recyclable.

The cases for the Packathon 2022 were submitted by Upfield, Cosun Beet Company and Unilever. Upfield is the world's largest producer of vegetable food products, such as liquid margarines, packaged in plastic squeeze bottles. Cosun Beet Company is the former Suiker Unie that not only produces sugar but also markets syrups under the Van Gilse brand. It is these product-packaging combinations that the Packathon focuses on. Furthermore, Unilever joins with their toothpaste packaging from the brand Prodent. 

This year, students from The Hague University of Applied Sciences, Amsterdam University of Applied Sciences and Delft University of Technology are taking part. The Packathon is organised by the KIDV in cooperation with the NTCP and with the Fieldlab Circular Packaging, which carries out research commissioned by brand owners - such as into the effects of product residues - to improve the recyclability of packaging.

 

'Packathon is a golden opportunity for students'

Also in the bus to the NTCP is Eline Bobbe. She is a student of Industrial Product Design at the Hogeschool Rotterdam and took part in last year's Packathon, which was then dedicated to disposable packaging. With her group, she devised a playful collection method for on-the-go coffee cups, so that they can be recycled and do not end up on the street as litter.

"Just taking part was incredibly informative. The experts who supervise the Packathon give you a lot of knowledge. We came up with 'Prick it', where consumers can prick their empty cup on special trees in the park or other places where many people come. In this way, they remain separate from other waste and can be collected and recycled as a mono-current. Reusing instead of abusing," says Bobbe.

Her group finished among the best three concepts. The reward was a presentation of the idea at the packaging fair Empack later in the year. "In the meantime, I developed the idea further together with Jasmijn Smit. It was the first time we gave such a presentation in front of an audience. The fact that as young designers you can present your own ideas is a great opportunity. And to also come into contact with a policy officer from the Ministry of Infrastructure & Water Management, who was very enthusiastic about the concept, gave me a lot of positive energy.

This kept Bobbe thinking about improvements to the concept, which eventually led to the design of a whole new coffee cup: the Tricup. It is not round, but triangular with the lid attached, made of one type of material and nestable. The first print run is scheduled for delivery in June, after which two pilots will be held. In the meantime, Bobbe has registered with the Chamber of Commerce; she hopes to graduate within her company at the end of June.

"Without the Packathon, this would never have come my way. That is why I think it is great that such events are organised. They offer students a golden opportunity. Because I enjoy it so much, I asked the KIDV if I could help to supervise the Packathon this year. And that's why I'll be on the bus next week.

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